INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SEMICONDUCTOR DEVICE MANUFACTURING METHOD, HEAT-RESISTANT MEMBER AND SEALING MATERIAL"

GENEVA, Feb. 3 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/026170) for "SEMICONDUCTOR DEVICE MANUFACTURING METHOD, HEAT-RESISTANT MEMBER, AND SEALING MATERIAL" on Jul 22, 2024. With publication no. WO/2026/022899, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inven...