INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE"

GENEVA, May 13 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/038947) for "RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE" on Oct 31, 2024. With publication no. WO/2025/095079, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YAMAUCHI, Arisa (...