GENEVA, Sept. 21 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/009951) for "RESIN COMPOSITION, RESIN FILM, LAMINATE, LAMINATE PLATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD FOR PRINTED WIRING BOARD" on Mar 14, 2024. With publication no. WO/2025/191778, the details related to the patent application was published on Sep 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manage...