INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "PRODUCTION METHODS FOR LAMINATE, LAMINATED BOARD, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE"

GENEVA, May 27 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/039165) for "PRODUCTION METHODS FOR LAMINATE, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE" on Nov 01, 2024. With publication no. WO/2025/105228, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WI...