INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "PREPREG, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE"

GENEVA, March 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/030331) for "PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE" on Aug 26, 2024. With publication no. WO/2025/052997, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): IGUCHI Kei...