INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "POSITIVE RESIST MATERIAL AND PATTERN-FORMING METHOD"

GENEVA, Dec. 1 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/010157) for "POSITIVE RESIST MATERIAL AND PATTERN-FORMING METHOD" on Mar 17, 2025. With publication no. WO/2025/243662, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): IMAI Yuya (c/o Resonac Corp...