GENEVA, Dec. 16 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/020913) for "POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, INSULATING RESIN FILM, METHOD FOR FORMING INSULATING RESIN FILM, AND SEMICONDUCTOR DEVICE" on Jun 07, 2024. With publication no. WO/2025/253646, the details related to the patent application was published on Dec 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World In...