GENEVA, April 15 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/035686) for "POLYMER, CURABLE RESIN COMPOSITION, CURED RESIN ARTICLE, ADHESIVE COMPOSITION, ADHESIVE FILM, AND ADHESIVE SHEET" on Oct 04, 2024. With publication no. WO/2025/075176, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property...