GENEVA, April 29 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/036588) for "PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD FOR PRINTED WIRING BOARD" on Oct 15, 2024. With publication no. WO/2025/084265, the details related to the patent application was published on Apr 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pr...