GENEVA, Dec. 1 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/018704) for "PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, METHOD FOR MANUFACTURING CURED PRODUCT PATTERN, AND METHOD FOR MANUFACTURING CONDUCTOR PATTERN" on May 21, 2024. With publication no. WO/2025/243400, the details related to the patent application was published on Nov 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system...