GENEVA, May 27 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/036499) for "PHOTOSENSITIVE RESIN COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE" on Oct 11, 2024. With publication no. WO/2025/105091, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (W...