GENEVA, Aug. 11 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目9番1号) filed a patent application (PCT/JP2024/037618) for "PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, AND IMAGE DISPLAY ELEMENT" on Oct 22, 2024. With publication no. WO/2025/163995, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ...