GENEVA, May 19 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目9番1号) filed a patent application (PCT/JP2024/039123) for "PHOTOSENSITIVE RESIN COMPOSITION, CURED OBJECT, AND SEMICONDUCTOR ELEMENT" on Nov 01, 2024. With publication no. WO/2025/100368, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KAWAU...