INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "PHOTOSENSITIVE POLYMER, PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM"

GENEVA, Sept. 16 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/008302) for "PHOTOSENSITIVE POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, AND CURED FILM" on Mar 05, 2024. With publication no. WO/2025/186904, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SATA...