GENEVA, July 2 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2023/045515) for "PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD" on Dec 19, 2023. With publication no. WO/2025/134231, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World...