INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR PRODUCING MOLDING MATERIAL FOR RESIN GEAR AND MOLDING MATERIAL FOR RESIN GEAR"

GENEVA, April 20 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/036480) for "METHOD FOR PRODUCING MOLDING MATERIAL FOR RESIN GEAR, AND MOLDING MATERIAL FOR RESIN GEAR" on Oct 11, 2024. With publication no. WO/2025/079696, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO). ...