INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR PRODUCING ARYL-ALKYLATED INDENE COMPOSITION, CURABLE RESIN MATERIAL, PREPREG, RESIN FILM, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE"

GENEVA, Dec. 30 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/020962) for "METHOD FOR PRODUCING ARYL-ALKYLATED INDENE COMPOSITION, CURABLE RESIN MATERIAL, PREPREG, RESIN FILM, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE" on Jun 10, 2025. With publication no. WO/2025/263396, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (I...