GENEVA, May 27 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目9番1号) filed a patent application (PCT/JP2024/039669) for "METHOD FOR MANUFACTURING WOUND BODY OF ADHESIVE FILM FOR CIRCUIT CONNECTION, AND WOUND BODY OF ADHESIVE FILM FOR CIRCUIT CONNECTION" on Nov 07, 2024. With publication no. WO/2025/105288, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Inte...