INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE THROUGH-VIA, METAL PASTE AND SUBSTRATE WITH CONDUCTIVE THROUGH-VIA"

GENEVA, July 29 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/001207) for "METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE THROUGH-VIA, METAL PASTE, AND SUBSTRATE WITH CONDUCTIVE THROUGH-VIA" on Jan 16, 2025. With publication no. WO/2025/154774, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pro...