INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND DICING/DIE-BONDING INTEGRATED FILM"

GENEVA, Feb. 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/028235) for "METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DICING/DIE-BONDING INTEGRATED FILM" on Aug 07, 2024. With publication no. WO/2025/033457, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inven...