GENEVA, Dec. 9 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/019430) for "METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD" on May 27, 2024. With publication no. WO/2025/248600, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): UETA Ts...