INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING GLASS SUBSTRATE WITH CONDUCTIVE VIA, METAL PASTE FOR FORMING THROUGH-GLASS ELECTRODE AND GLASS SUBSTRATE WITH CONDUCTIVE VIA"

GENEVA, Aug. 11 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/035286) for "METHOD FOR MANUFACTURING GLASS SUBSTRATE WITH CONDUCTIVE VIA, METAL PASTE FOR FORMING THROUGH-GLASS ELECTRODE, AND GLASS SUBSTRATE WITH CONDUCTIVE VIA" on Oct 02, 2024. With publication no. WO/2025/163977, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manag...