INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND CIRCUIT CONNECTION STRUCTURE"

GENEVA, May 18 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/035288) for "METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE" on Oct 02, 2024. With publication no. WO/2025/100136, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectu...