GENEVA, April 15 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/035697) for "MATERIAL SELECTION ASSISTANCE DEVICE, METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD CORE, AND CIRCUIT BOARD" on Oct 04, 2024. With publication no. WO/2025/075181, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Prope...