GENEVA, Aug. 5 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/001923) for "MALEIMIDE RESIN, RESIN COMPOSITION, CURED PRODUCT, SHEET, LAYERED PRODUCT, AND PRINTED WIRING BOARD" on Jan 22, 2025. With publication no. WO/2025/159125, the details related to the patent application was published on Jul 31, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (...