INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE"

GENEVA, March 31 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2023/034600) for "LIQUID RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE" on Sep 22, 2023. With publication no. WO/2025/062657, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): UCHIYAM...