INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "LAMINATE FOR FORMING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE"

GENEVA, Oct. 19 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/006398) for "LAMINATE FOR FORMING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE" on Feb 25, 2025. With publication no. WO/2025/215954, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....