INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "LAMINATE, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE AND COMMUNICATION DEVICE"

GENEVA, March 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/030868) for "LAMINATE, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE, AND COMMUNICATION DEVICE" on Aug 29, 2024. With publication no. WO/2025/053034, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Prop...