GENEVA, Sept. 9 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目9番1号) filed a patent application (PCT/JP2025/002104) for "HEAT STORAGE MATERIAL AND METHOD FOR PRODUCING HEAT STORAGE MATERIAL" on Jan 23, 2025. With publication no. WO/2025/182363, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIMIZU, ...