INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "HEAT-CONDUCTING SHEET, HEAT-DISSIPATING DEVICE, HEAT-CONDUCTING SHEET PRODUCTION METHOD AND ADHESIVE LAYER-FORMING COMPOSITION"

GENEVA, July 14 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/000026) for "HEAT-CONDUCTING SHEET, HEAT-DISSIPATING DEVICE, HEAT-CONDUCTING SHEET PRODUCTION METHOD, AND ADHESIVE LAYER-FORMING COMPOSITION" on Jan 04, 2024. With publication no. WO/2025/146713, the details related to the patent application was published on Jul 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intelle...