INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "FILM-LIKE ADHESIVE, DICING AND DIE-BONDING INTEGRATED FILM, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME"

GENEVA, Feb. 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2023/029152) for "FILM-LIKE ADHESIVE, DICING AND DIE-BONDING INTEGRATED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME" on Aug 09, 2023. With publication no. WO/2025/032779, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Proper...