INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "DIE ATTACHMENT FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD"

GENEVA, April 1 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/033337) for "DIE ATTACHMENT FILM, DICING DIE BONDING FILM, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD" on Sep 18, 2024. With publication no. WO/2025/063210, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....