GENEVA, April 7 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/015326) for "DICING/DIE-BONDING INTEGRATED FILM AND METHOD FOR MANUFACTURING SAME" on Apr 17, 2024. With publication no. WO/2025/069527, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OHKUBO Ke...