INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "DETERGENT COMPOSITION AND METHOD FOR CLEANING MOLDING DIE"

GENEVA, Feb. 3 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2023/027451) for "DETERGENT COMPOSITION AND METHOD FOR CLEANING MOLDING DIE" on Jul 26, 2023. With publication no. WO/2025/022627, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): UNOKI, Kensaku (c/o R...