GENEVA, Jan. 6 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/022918) for "CURABLE RESIN COMPOSITION AND STRUCTURE" on Jun 25, 2025. With publication no. WO/2026/004928, the details related to the patent application was published on Jan 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): AKIMOTO Maho (c/o Resonac Corporation, ...