GENEVA, Feb. 4 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/025691) for "BUMP-EQUIPPED CIRCUIT MEMBER, METHOD FOR MANUFACTURING BUMP-EQUIPPED CIRCUIT MEMBER, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE" on Jul 17, 2024. With publication no. WO/2025/023127, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is ...