INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ARYLALKYL-MODIFIED INDENE COMPOSITION, CURABLE RESIN MATERIAL, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE"

GENEVA, Dec. 29 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/022558) for "ARYLALKYL-MODIFIED INDENE COMPOSITION, CURABLE RESIN MATERIAL, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE" on Jun 21, 2024. With publication no. WO/2025/262918, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is man...