GENEVA, Oct. 13 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/009021) for "ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SAME, DICING DIE-BONDING INTEGRATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE" on Mar 11, 2025. With publication no. WO/2025/211117, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manage...