INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ADHESIVE FILM FOR CIRCUIT CONNECTION AND CIRCUIT CONNECTION STRUCTURE AND PRODUCTION METHOD THEREFOR"

GENEVA, March 10 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/031045) for "ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND PRODUCTION METHOD THEREFOR" on Aug 29, 2024. With publication no. WO/2025/047902, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizati...