GENEVA, Feb. 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/027776) for "ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, WIRING FORMATION MEMBER, FORMATION METHOD FOR WIRING LAYER, AND WIRED MEMBER" on Aug 02, 2024. With publication no. WO/2025/033357, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectua...