INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, MEMBER FOR WIRING FORMATION, METHOD FOR FORMING WIRING LAYER AND WIRING FORMING MEMBER"

GENEVA, Feb. 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/027775) for "ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, MEMBER FOR WIRING FORMATION, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMING MEMBER" on Aug 02, 2024. With publication no. WO/2025/033356, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World ...