GENEVA, June 24 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/043684) for "ADHESIVE COMPOSITION AND BONDED OBJECT" on Dec 10, 2024. With publication no. WO/2025/127042, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MASAKI Takeshi (c/o Resonac Corporation...