INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ADHESIVE COMPOSITION, ADHESIVE FILM, LAMINATE AND METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE"

GENEVA, April 1 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/032936) for "ADHESIVE COMPOSITION, ADHESIVE FILM, LAMINATE, AND METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE" on Sep 13, 2024. With publication no. WO/2025/063142, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization...