INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ADHESIVE AND METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE"

GENEVA, March 25 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/032393) for "ADHESIVE AND METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE" on Sep 10, 2024. With publication no. WO/2025/057946, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SATO Mayum...