INTERNATIONAL PATENT: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY, 성균관대학교 산학협력단 FILES APPLICATION FOR "SEMICONDUCTOR CHIP PACKAGE HAVING LOW-MELTING-POINT SOLDER-HIGH-MELTING-POINT SOLDER-LOW-MELTING-POINT SOLDER BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR"

Posted On: 2025-12-10

GENEVA, Dec. 10 -- RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY ((Cheoncheon-dong, Sungkyunkwan University) 2066 Seobu-roJangan-gu, Suwon-siSeoul 16419), 성균관대학교 산학협력단 (서울특별시수원시 장안구서부로 2066 (천천동, 성균관대학교)) filed a patent application (PCT/KR2025/006708) for "SEMICONDUCTOR CHIP PACKAGE HAVING LOW-MELTING-POINT SOLDER-HIGH-MELTING-POINT SOLDER-LOW-MELTING-POINT SOLDER BONDING STRUCTURE, AND MANUFACTURING METHOD THEREFOR" on May 16, 2025. With publication no. WO/2025/249813, the details related to the p...

Click here to read full article from source

To read the full article or to get the complete feed from this publication, please Contact Us.

Exclusive

Category

Source

Publication

Location

INTERNATIONAL PATENT: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY, 성균관대학교 산학협력단 FILES APPLICATION FOR "SEMICONDUCTOR CHIP PACKAGE HAVING LOW-MELTING-POINT SOLDER-HIGH-MELTING-POINT SOLDER-LOW-MELTING-POINT SOLDER BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR"