GENEVA, April 15 -- RAYAMA PACK CO., LTD. (1-7-5 Higashitateisi, Katsushika-ku, Tokyo1240013), 株式会社ラヤマパック (東京都葛飾区東立石１丁目７番５号), MITSUWA CORPORATION (1-16-12 Toneri, Adachi-ku, Tokyo1210831), ミツワ株式会社 (東京都足立区舎人１丁目１６番１２号) filed a patent application (PCT/JP2024/027234) for "MOLD AND PARTS OF MOLD FOR PRODUCING CHOCOLATE" on Jul 30, 2024. With publication no. WO/2025/074724, the details related to the pa...