GENEVA, April 5 -- RADROCK(CHONGQING)TECH CO.,LTD. (No. 117-450, Yunhan Avenue, Beibei DistrictBeibei District, Chongqing 400700), 锐石创芯（重庆）科技有限公司 (中国重庆市北碚区云汉大道117号附450号) filed a patent application (PCT/CN2024/119838) for "CHIP PACKAGING STRUCTURE AND RADIO FREQUENCY FRONT-END MODULE" on Sep 19, 2024. With publication no. WO/2025/067031, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the ...