INTERNATIONAL PATENT: QUALCOMM INCORPORATED, CAO, YAN, HE, HUI, TANG, WEI, YE, FEIHU FILES APPLICATION FOR "HEAT DISSIPATION DEVICE EMPLOYING A HEAT TRANSFER CHAMBER WITH OPENING (S) FOR IMPROVED HEAT SINK AIR FLOW AND HEAT DISSIPATION AND RELATED ASSEMBLY METHODS"

Posted On: 2025-06-09

GENEVA, June 9 -- QUALCOMM INCORPORATED (Attn: International IP Administration, 5775 Morehouse Drive San DiegoCalifornia 92121-1714), CAO, Yan (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), HE, Hui (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), TANG, Wei (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), YE, Feihu (5775 Morehouse Drive, San DiegoCalifornia 92121-1714) filed a patent application (PCT/CN2023/135835) for "HEAT DISSIPATION DEVICE EMPLOYING A HEAT TRANSFER CHAMBER WITH OPENING (S) FOR IMPROVED HEAT SINK AIR FLOW AND HEAT DISSIPATION, AND RELATED ASSEMBLY METHODS" on Dec 01, 2023. With publication no. WO/2025/112033, the details related to the patent application was published on Jun 05, 2025.

Notably, the ...

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INTERNATIONAL PATENT: QUALCOMM INCORPORATED, CAO, YAN, HE, HUI, TANG, WEI, YE, FEIHU FILES APPLICATION FOR "HEAT DISSIPATION DEVICE EMPLOYING A HEAT TRANSFER CHAMBER WITH OPENING (S) FOR IMPROVED HEAT SINK AIR FLOW AND HEAT DISSIPATION AND RELATED ASSEMBLY METHODS"