INTERNATIONAL PATENT: QINGDAO GOERTEK MICROELECTRONICS RESEARCH INSTITUTE CO.,LTD, 青岛歌尔微电子研究院有限公司 FILES APPLICATION FOR "SYSTEM-IN-PACKAGE MODULE AND PREPARATION METHOD AND SMART RING"

Posted On: 2026-01-04

GENEVA, Jan. 4 -- QINGDAO GOERTEK MICROELECTRONICS RESEARCH INSTITUTE CO.,LTD (F Building, Phase II, Qingdao International Innovation Park, No.1, Keyuanwei 1st Road, Laoshan District,Qingdao, Shandong 266100), 青岛歌尔微电子研究院有限公司 (中国山东省青岛市崂山区科苑纬一路1号青岛国际创新园二期F楼) filed a patent application (PCT/CN2024/142255) for "SYSTEM-IN-PACKAGE MODULE AND PREPARATION METHOD, AND SMART RING" on Dec 25, 2024. With publication no. WO/2026/000904, the details related to the patent a...

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INTERNATIONAL PATENT: QINGDAO GOERTEK MICROELECTRONICS RESEARCH INSTITUTE CO.,LTD, 青岛歌尔微电子研究院有限公司 FILES APPLICATION FOR "SYSTEM-IN-PACKAGE MODULE AND PREPARATION METHOD AND SMART RING"