GENEVA, April 20 -- POLYPLASTICS-EVONIK CORPORATION (3-1, Nishi-shinjuku 2-chome, Shinjuku-ku, Tokyo1630913), ポリプラ・エボニック株式会社 (東京都新宿区西新宿２丁目３－１) filed a patent application (PCT/JP2024/036062) for "RESIN COMPOSITION AND GEAR" on Oct 09, 2024. With publication no. WO/2025/079594, the details related to the patent application was published on Apr 17, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s):...